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SIM Broadcom Bonded xDSL Module

  • TESSCO SKU: 585147
  • QTY/UOM: 1 EACH
  • UPC: 729198131609
  • MFG PART #: HST3000-BDCM-WB21

VIAVI HST-3000 SIM BDCM-WB2-1 Broadcom Bonded xDSL Module. For use with HST-3000 and HST-3000C mainframes. 2mm copper interace connectors at the top of the SIM can be used for both copper testing and xDSL testing.

Technical Specs

  • Qty/ Uom
    1 Each
  • Manufacturer
    Viavi Solutions Inc.